|
項 目
|
一 般
|
Limit
|
備 註
|
FPC
厚度公差 |
 |
|
± 0.03mm(± 1.2mil) |
± 0.02mm(± 0.8mil) |
|
| Sn電鍍 |
 |
|
6~14μm(10±4μm") |
|
|
| Ni-Au電鍍 |
Ni:3~6μm(120~240u")
Au:Min 0.03μm(Min 1.2μ")
max 0.2~1μm(8~40μ")
|
|
|
| Chemical Ni-Au |
Ni:3~6μm(120~240μ")
Au:min 0.03μm(1.2μ")
max 0.3048μm(12μ")
|
|
|
|
|
項 目
|
一 般
|
Limit
|
備 註
|
Coverlayer
PAD貼合位置公差 |
 |
|
± 0.15mm(± 6mil) |
± 0.1mm(± 4mil) |
|
Coverlayer
與相鄰線路距離 |
 |
|
± 0.15mm(± 6mil) |
± 0.1mm(± 4mil)
|
|
| 烘烤型可撓性油墨位置公差 |
± 0.3mm(± 12mil) |
± 0.2mm(± 8mil) |
|
| 顯影型可撓性油墨位置公差 |
± 0.1mm(± 4mil) |
± 0.05mm(± 2mil) |
|
| 可撓性油墨厚度公差 |
12.7~38μm
(1±0.5mil)
|
≦25μm
(≦1mil) |
|
| 烘烤型銀漿位置公差 |
± 0.3mm(± 12mil)
|
± 0.2mm(± 8mil) |
|
|
|
項 目
|
一 般
|
Limit
|
備 註
|
| 鋼模內凹R角
|
 |
|
0.5mm(20mil) |
0.1mm(4mil) |
|
| 刀模內凹R角 |
|
|
0.5mm(20mil) |
蝕刻刀模:
0.2mm(8mil)
木製刀模:
0.7mm(28mil)
|
|
| 鋼模最小孔徑 |
Φ0.8±0.05 |
Φ0.4mm(16mil) |
|
| 鋼模最小異孔尺寸 |
 |
|
|
0.4mm(16mil) |
|
| 一次沖型 |
 |
|
0.5mm(20mil)
|
0.4mm(16mil) |
|
| 一次沖型 |
 |
|
0.5mm(20mil)
|
0.4mm(16mil) |
|
|
|
項 目
|
一 般
|
Limit
|
備 註
|
| 電鍍純錫 |
60~240μ" |
|
|
| 線寬公差 |
0.05＜W≦0.075 ± 0.02mm
(2＜W＜3 ± 0.8mil)
0.075＜W≦ 0.15 ± 0.03mm
(3＜W＜6 ± 1.2mil)
0.15＜W ≦ 0.25 ± 0.04mm
(6＜W≦10 ± 1.6mil)
0.25＜W≦0.5 ± 0.05mm
(10＜W≦20 ± 2mil)
W＜0.5 ± 0.08mm
(W＜20 ± 3.15mil)
|
|
|
| 鋼模尺寸公差 |
L≦70 ± 0.05mm
(L≦2756 ± 2mil)
70＜L≦ 200± 0.1mm
(2756＜L ± 4mil) |
|
|
| 刀模尺寸公差 |
L＜150 ± 0.1mm
(L＜5905 ± 4mil)
150≦L ± 0.15mm
(5905≦L ± 6mil) |
|
|
| 補強板孔徑公差 |
D≦0.6 ± 0.1mm
(D≦24 ± 4mil)
0.6＜D≦1.6 ± 0.15mm
(24＜D≦64 ± 6mil)
1.6＜D ± 0.2mm
(64＜D ± 8mil)
|
|
|
| 成品孔徑 |
Φ0.15mm(6mil)
|
Φ0.1mm(4mil) |
|
|
|
項 目
|
一 般
|
Limit
|
備 註
|
| Line
Width |
 |
|
≧ 0.075mm(≧3mil) |
0.05mm(2mil) |
|
| Line
Space |
 |
|
≧ 0.075mm(≧3mil) |
0.05mm(2mil)
|
|
| Annular
ring |
 |
|
0.15mm(6mil) |
0.075mm(3mil) |
|
線路與
外形距離 |
 |
|
0.2mm(8mil)
|
0.15mm(6mil) |
|
Coverlayer
貼合公差 |
 |
|
± 0.2mm (± 8mil) |
± 0.15mm(± 6mil)
|
|
| PET
PI貼合公差 |
 |
|
±0.3mm (± 12mil) |
± 0.2mm(± 8mil)
鋼模+Tooling |
|
|
|
項 目
|
一 般
|
Limit
|
備 註
|
| Hole |
D≦0.6 ± 0.05mm
(D≦24 ± 2mil)
0.6<D≦1.6 ± 0.08mm
(24＜D≦63 ± 3.15mm)
1.6＜D ± 0.1mm
(63＜D ± 4mil) |
|
|
| FR4 router公差 |
± 0.15mm(6mil) |
± 0.1mm(4mil)
|
|
| 鍍銅厚度 |
 |
|
0.017 ± 0.0076mm
(0.7 ± 0.3mil) |
(max1.5 ± 0.3mil) |
|
| 累積Pitch |
 |
|
A≦50 ± 0.05mm
(A≦2000 ± 2mil)
50<A≦100 ± 0.075mm
2000<A≦4000 ± 3mil
100<A ± 0.1mm
(4000<A ± 4mil)
|
|
|
|
|
項 目
|
一 般
|
Limit
|
備 註
|
感壓膠
貼合公差 |
 |
|
± 0.3mm( ± 12mil) |
± 0.2mm( ± 8mil)
|
|
| FR4貼合公差 |
 |
|
± 0.3mm( ± 12mil) |
± 0.1mm(± 4mil)
|
|
| 角度公差 |
 |
|
1° |
0.5° |
|
| 反折公差 |
 |
|
± 0.5mm
|
± 0.2mm(± 8mil)
|
|
Pitch=1.0 ± 0.15mm
(Pitch=40 ± 6mil) |
|
|
端子部線路與
外型公差 |
 |
|
Pitch=0.5 ± 0.1mm
(Pitch=20 ± 4mil) |
± 0.07mm (± 2.75mil) |
|
端子部
厚度公差 |
 |
|
0.3 ± 0.05mm
(12 ± 2mil) |
0.3 ± 0.03mm
(12 ± 1.2mil) |
|
|
|
項 目
|
一 般
|
Limit
|
備 註
|
| 烘烤型銀漿貫孔能力 |
Φ0.5mm(Φ20mil) |
Φ0.3mm(Φ12mil) |
|
| 烘烤型網印文字位置公差 |
± 0.3mm( ± 12mil) |
± 0.2mm( ± 8mil)
|
|
| 烘烤型網印文字油墨線寬 |
0.15mm(6mil) |
0.1mm(4mil) |
|
| 銀漿厚度 |
3~8μm(120~320μ")
|
|
|
Solder Mask厚度
(覆蓋於銀漿上使用於手機板) |
10~16 μm(400~640μ") |
|
|
Solder Mask厚度
(覆蓋於銀漿上使用於非手機板) |
10~20 μm(400~800 μ") |
|
|
|
