| 1 |
Structure |
8 / 2 / 8 |
8 / 2 / 8 |
11 / n / 11 |
11 / n / 11 ~ |
| 2 |
Max. Body Size (mm) |
65 x 65 |
77.5 x 77.5 |
77.5 x 77.5 ~ |
| 3 |
FC Bump Pitch Array Type (SOP) |
130 |
90 * |
90 * |
80 * |
| 4 |
FC Bump Pitch Peripheral Type (BOL) |
40 / 80 |
30 / 60 |
| 5 |
SRO / Bump Pad (w / Escape Trace) |
65 / 90 |
45 / 67 ( 7 / 8) |
45 / 67 ( 7 / 8) |
40 / 64 ( 4 / 6) |
| 6 |
SRO / Bump Pad (w / o Escape Trace) |
40 / 80 |
30 / 60 |
30 / 60 |
30 / 60 |
| 7 |
Surface Finish ( Bump / SMD / BGA ) |
OSP |
| 8 |
Presolder (Bump / SMD / BGA) |
SAC 305,Sn / Cu |
| 9 |
BU Layer Line / Space |
9 / 12 |
7 / 8 |
7 / 8 |
4 / 6 |
| 10 |
BU Layer Vla / Land Diameter |
60 / 85 |
30 / 55 |
30 / 52 |
25 / 45 ~ 20 / 40 |
| 11 |
Core Layer L / S (Subtractive) |
25 / 25 |
20 / 25 |
20 / 25 |
15 / 25 |
| 12 |
Core Layer L / S (MSAP) |
20 / 20 |
15 / 20 |
14 / 18 |
12 / 16 |
| 13 |
PTH / Land Diameter (0.8mm Core) |
150 / 250 |
150 / 240 |
150 / 240 |
150 / 240 |
| 14 |
PTH / Land Diameter (0.4mm Core) |
100 / 200 |
100 / 190 |
100 / 190 |
100 / 190 |
| 15 |
Core Thickness |
≥ 400 |
≥ 400 |
| 16 |
Core Material |
Low CTE (10 ~ 2 ppm) |
Ultra Low CTE ( < 1ppm ) |
| 17 |
Build up Material |
CTE ~ 20 ppm |
CTE ~ 20 ppm |
| 18 |
Solder Resist Material |
CTE ~ 20 ppm |
CTE < 10 ppm |
| * Ball placement available upon request |
